Review from Kevin Byrd, Principal Engineer, Intel Corporation
"This book provides an excellent overview of both the history of low-temperature solders as well as the recent progress in this exciting surface mount technology. This information will prove valuable for those actively pursuing low-temperature solder conversion of their manufacturing processes as well as those working to understand the progress and future for the low-temperature solder materials."
Review from Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies
"I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book."
Review from Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.
"Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. In order to find the right balance between benefit and effort, the author suggests using analytical approaches to configure the process and its settings. Additionally, she is always conscious of the need for sustainability when it comes to electronic assemblies."
Review from Gus Becerra, Principal Manufacturing Engineer, Marvell
"As fabrication and manufacturing technologies advance, it is necessary to evolve our methods to analyze and review designs. This book utilizes data-driven concepts in all aspects of the fabrication and assembly processes to improve design capabilities.
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Review from Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
"This book provides unprecedented visibility of SMT processes, asserting inspection technology as a key active contributor to zero-defect quality initiatives, rather than being limited to simple defect detection."
Review from Mike Cummings, Technical Director, TSI
"What I like about this book is it's not based on fear marketing; rather, it is an honest appraisal of a difficult decision companies have to make toward their product service life, based on the product field data and established and proven test processes."
Review from Dan Beaulieu
"A "must-have" guidebook for everyone involved in Flex technology."
Review from Bob Tise, R&D Engineer, EMP Shield
"PCB design is as much art as science. While reading this book will not, itself, make you a professional PCB designer, it will help you make better decisions and trade-offs, saving time and money."
Review from Lambert Schutters, General Manager,
ESCATEC Penang
"We need the right tools to create the best design for the intended purpose. This book is a great introduction and guide on how to approach the process holistically."
Review from Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC
"This textbook is a great addition and supplement to the first edition. It delves deeper into the science of insulated metal substrates and their useful, often overlooked, properties for proper thermal management."
Review from Binayak Shrestha, Senior Research Engineer at C-DOT
"The most important aspect in the whole design process is getting the stackup correct. This book is one such rare gem which consolidates all the information in one single place!"
Review from Gerry Partida, VP of Technology, Summit Interconnect
"Michael Gay’s book is a concise and detailed explanation of the critical materials that makes up a PCB. His thorough explanation will help any engineer, designer and fabricator understand the impact of the material selection in a PCB stackup. This book is truly a gift to the electronics industry and I thank him for sharing his knowledge with us."
Review from Joe O'Neil, Principal, OAA Ventures
"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."
Review from Lee Ritchey, Founder and President, Speeding Edge
"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."
Review from Happy Holden, Consulting Technical Editor, I-Connect007
"This book provides good education, with examples and explanations to help the reader understand how the smart factory can improve performance and competitiveness."
Review from Dan Beaulieu, President, DB Management Group
"For those who are, shall we say, 'less technical' than others, it’s refreshing—not to mention face-saving, at times—to be able to understand terms like insulated metal-clad PCBs (IMPCBs), metal-clad PCBs (MCPCBs) and mixed-technology PCBs."
Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH
"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification.
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Review from Happy Holden, Consulting Technical Editor, I-Connect007
"This is essential reading for those who are wondering, "What can smart factories do for me?" The Mentor/Siemens description of how Industry 4.0 can benefit an electronics manufacturer, and how to go about using such a concept, is both detailed and easy to understand. It is one of the best books on the subject!"
Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison
"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."
Review from John R. Watson, Legrand North America
"At a time when electronics are not just taking small steps but rather large leaps forward, this is an appropriate book for anyone working with PCB design. With countless and ever-changing steps involved in every design, it presents a clear understanding of the process. This book will be the go-to reference for all of our designers at Legrand North America."
Review from Alex Stepinski, vice president, GreenSource Fabrication
"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences.
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Review from Dan Beaulieu, president, D.B. Management
"If you are serious about creating the best, most perfect data packages available today, do yourself a favor. Download and read this book. It’s simple—the better the package, the better the board.
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Review from Happy Holden, Consulting Technical Editor, I-Connect007
"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."
Review from Andy Shaughnessy, Managing Editor, Design007 Magazine
"This book will help the reader gain a comprehensive understanding of the physical realities of insulated metal substrates and their applications in the thermal management of electronic assemblies."
Review from Robert Tarzwell, PCB technologist, inventor, and writer
"A concise ebook written in plain English so anyone can improve their
RF and high-frequency printed circuit design. From Dk through edge
plating, this book covers all areas of manufacturing an RF PCB, and
provides many drawings and charts to clearly show each process."
Review from Andy Shaughnessy
"This micro eBook should be required reading for every PCB designer or design engineer, whether novice or veteran. This book makes a great follow-up to Mentor’s previous eBook, The Printed Circuit Designer’s Guide to…Signal Integrity."
Review from Stephen Las Marias, Managing Editor, SMT Magazine
"To those looking to know more about conformal coatings—from fundamentals and testing, to industry standards and best practices—this micro eBook is the best starting point. Not only does this eBook provide the most important bits of information, but it also presents case studies to help you create successful conformal coating strategies for your applications."
Review from Terry Fox
"I found this to be an excellent tutorial on controlled impedance transmission lines, terminations, crosstalk, differential pair design and PDN noise, and Mentor’s virtual labs take learning to a whole new level!"
Review from Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.
"I wish I had these books when I was starting out in my career."
Review from Andy Shaughnessy
"This book has everything you need to know about solderless assembly process, which could be the most innovative—and disruptive—technological development in our industry’s history."
Review from Eric Bogatin
"The Printed Circuit Designer's Guide to... Secrets of High-Speed PCBs, Part 1 pulls back the covers to illustrate the practical principles behind many of the confusing topics that arise in the overlap between manufacturing, materials, and signal integrity performance."
Review from Andy Shaughnessy
"There are plenty of PCB books available now, but not many focus on DFM. Altium’s new e-book, The Printed Circuit Designer's Guide to...Design for Manufacturing (DFM), has everything you need to know to get your board ‘right the first time."
Review from Dan Beaulieu
"This book is long overdue. Finally, a book on AS9100 certification written in clear and concise language.""