The IPC HDI Conference: Advancements in Materials, Processes and Applications will be held in Los Angeles, California October 24-25, 2012.

Breakthroughs in materials, processes and applications for high density interconnect (HDI) boards are being made every day. Sponsored by Raytheon, this event will bring OEMs, fabricators and suppliers together to explore the newest advancements and solve challenges.

To register, click here.

WORKSHOPS

Advanced HDI Design Strategies

October 24

9:00 a.m. to 12:00 p.m.

Happy Holden, Director of Electronics and Innovations, Gentex Corporation

This workshop will look at low-cost, efficient HDI design strategies and principles. The workshop will include an introduction to HDI design principles, eight essential HDI design strategies for BGA breakout and case studies on redesigning a current board to HDI.

What you will learn:

• Need for blind and buried vias in design;
• Barriers that through holes create;
• Applications of HDI (microvias) in complex designs;
• BGA design challenges, board stackup, design rules, and layout;
• Microvia structures and simplifying multilayers by reducing layers;
• Creating boulevards to increase routing density;
• High-speed problems overcome by microvias; and
• Review of IPC standards for advanced interconnects and HDI.

Integrating Advanced Microvia Structures in Complex Circuits

2:00 p.m. to 5:00 p.m.

Tom Buck, Senior Technologist, Viasystems Group, Inc.

The goal of this workshop is to take a systems approach to the interconnect challenge associated with complex printed circuits.

Issues to be addressed include:

• Design tradeoffs that are often necessary when combining technologies with an underlying theme of increasing reliability and minimizing fabrication costs;
• Interconnection requirements imposed by chip scale array packages in terms of the unique via structures, both microvia and mechanically drilled, that are often needed;
• Material concerns in terms of dielectric properties and geometries associated with advanced microvia structures with particular attention to sequential lamination and hybrid dielectric constructions; and
• Integration of low impedance power delivery with embedded capacitance materials as well as enhanced structures to improve thermal performance.